Nihon Superior Centre
for the Manufacture of Electronic Materials

 

Peer Reviewed Journal Publications
  1. K. Nogita, X. Q. Tran, T. Yamamoto, E. Tanaka, S. D. McDonald, C. M. Gourlay, K. Yasuda and S. Matsumura, “Reply to ‘Comments on “Evidence of the hydrogen release mechanism in bulk MgH2”’”, Scientific Reports, accepted on 10th Dec. 2016 (SREP-16-41015).
  2. J.W. Xian, S.A. Belyakov, M. Ollivier, K. Nogita, H. Yasuda, C.M. Gourlay, “Cu6Sn5 crystal growth mechanisms during solidification”, Acta Materialia, accepted on 19th Dec. 2016.
  3. X. Q. Tran, S. D. McDonald, Q. F. Gu, X. F. Tan, K. Nogita, “Effect of trace Na additions on the hydriding kinetics of hypo-eutectic Mg-Ni alloys International Journal of Hydrogen Energy”, International Journal of Hydrogen Energy, accepted on 2nd Dec. 2016.
  4. M. A. A. Mohd Salleh, C.M. Gourlay, J.W. Xian, S.A. Belyakov, H. Yasuda, S. D. McDonald, K. Nogita, “In situ imaging of microstructure formation in electronic interconnections”, Scientific Reports, accepted on 30th Nov. 2016.
  5. X. Q. Tran, S. D. McDonald, Q. F. Gu, T. Yamamoto, K. Shigematsu, K. Aso, E. Tanaka, S. Matsumura, K. Nogita, “In-situ investigation of the hydrogen release mechanism in bulk Mg2NiH4”, Journal of Power Source, 341 (2017) 130-138.
  6. M. A. A. Mohd Salleh, S. D. McDonald, K. Nogita, “Effects of Ni and TiO2 additions in as-reflowed and annealed Sn0.7Cu solders on Cu substrates”, Journal of Materials Processing Technology, 242 (2017) 235-245.
  7. X. Q. Tran, S. D. McDonald, Q. F. Gu, X. F. Tan, K. Nogita, “Effect of impurity N2 concentration on the hydriding kinetics of Na-doped Mg–Ni alloys”, International Journal of Hydrogen Energy, accepted on 16th Aug. 2016.
  8. K. Nogita, M. A. A. Mohd Salleh, E. Tanaka, G. Zeng, S. D. McDonald, S. Matsumura, “In-situ TEM observations of Cu6Sn5 polymorphic transformations in reaction layers between Sn-0.7Cu solders and Cu substrates”, JOM, 68, 11 (2016) 2871-2878.
  9. G. Zeng, S. D. McDonald, D. Mu, Y. Terada, H. Yasuda, Q. F. Gu, M.A.A.Mohd Salleh, K. Nogita, “The influence of ageing on stabilisation of interfacial (Cu,Ni)6(Sn,Zn)5 and (Cu,Au,Ni)6Sn5 intermetallic in solder joints”, Journal of Alloys and Compounds, 685 (2016) 471-482.
  10. S. Smith, J. Read, S. D. McDonald and K. Nogita, “Peritectic reactions and phase transformations of Sn-30wt%Cu for high temperature Pb-free soldering applications”, Materials Science Forum 857 (2016) 58-62.
  11. K. M. Watling, A. Chandler-Temple, K. Nogita, “XPS analysis of oxide films on lead-free solders with trace additions of germanium and gallium”, Materials Science Forum 857 (2016) 63-67. 
  12. K. Nogita, B. Kefford, J. Read and S. D. McDonald, “Suppression of Cu3Sn with Ni in high Cu containing Sn-Cu solder alloys”, Materials Science Forum 857 (2016) 53-57.
  13. K. Nogita, M. A. A. M. Salleh, X. Q. Tran, J. Read, S. Smith and S. D. McDonald, “Effects of trace phosphorus in Sn-Cu-Ni wave solder dross”, Materials Science Forum 857 (2016) 49-52. 
  14. C. M. Gourlay, Z. L. Ma, J. W. Xian,  S. A. Belyakov, M. A. A. Mohd Salleh, G. Zeng, H. Yasuda and K. Nogita, “Solidification of Sn-3Ag-0.5Cu and Sn-0.7Cu-0.05Ni solders”, Materials Science Forum 857 (2016) 44-48.
  15. M. A. A. Mohd Salleh, R. M. Said, N. Saud, H. Yasuda, S. D. McDonald and K. Nogita, “Effect of TiO2 on the formation of primary and interfacial Cu6Sn5 in Sn-0.7wt%Cu and Sn-0.7wt%Cu-0.05wt%Ni solder paste during soldering”, Key Engineering Materials, 700 (2016) 161-169.
  16. X. Q. Tran, S.D. McDonald, Q.F. Gu, S. Matsumura, K. Nogita, “Effect of trace Na additions on the hydrogen absorption kinetics of Mg2Ni”, Journal of Materials Research, 31 (2016) 1316-1327.
  17. M. A. A. Mohd Salleh, S. D. McDonald, H. Yasuda, K. Nogita, “Effect of Ni on the formation and growth of primary Cu6Sn5 intermetallics in Sn-0.7wt%Cu solder pastes on Cu substrates during the soldering process”, Journal of Electronic Materials, 45 (2016) 154-163.
  18. D. Mu, S. D. McDonald, J. Read, H. Huang, K. Nogita, “Critical properties of Cu6Sn5 in electronic devices: Recent progress and a review”, Current Opinion in Solid State & Materials Science, 20 (2016) 55-76.
  19. G. Zeng, S. D. McDonald, Q. Gu, S. Matsumura and K. Nogita, “Kinetics of β→α transformation of tin: Role of α–tin nucleation”, Crystal Growth & Design, 15, (2015) 5767−5773.
  20. D. Ye, G. Zeng, K. Nogita, K. Ozawa, M. Hankel, D. J. Searles and L. Wang, “Understanding the origin of the Li2MnO3 activation in Li-rich cathode materials”, Advanced Functional Materials, 25 (2015) 7488-7496.
  21. A. Prasad, S. D. McDonald, H. Yasuda, K. Nogita, D. H. StJohn, “A real-time synchrotron X-ray study of primary phase nucleation and formation in hypoeutectic Al-Si alloys”, Journal of Crystal Growth, 430, (2015) 122-137.
  22. M. A. A. Mohd Salleh, S. D. McDonald, Y. Terada, H. Yasuda, K. Nogita, “Development of a microwave sintered TiO2 reinforced Sn-0.7wt%Cu-0.05wt%Ni alloy”, Materials and Design, 82 (2015) 136–147.
  23. H. Henao, C. Masuda and K. Nogita, “Metallic tin recovery from wave solder dross”, International Journal of Mineral Processing, 137 (2015) 98-105.
  24. X. Q. Tran, S.D. McDonald, Q.F. Gu, K. Nogita, “In-situ synchrotron X-ray diffraction investigation of hydriding and dehydriding properties of a cast Mg-Ni alloy”, Journal of Alloys and Compounds, 636 (2015) 249–256.
  25. K. Nogita, X. Q. Tran, T. Yamamoto, E. Tanaka, S. D. McDonald, C. M. Gourlay, K. Yasuda and S. Matsumura, “Evidence of the hydrogen release mechanism in bulk MgH2”, Scientific Reports, 5, 8450; DOI:10.1038/srep08450 (2015).
  26. M. A. A. Mohd Salleh, S. D. McDonald, H. Yasuda, A. Sugiyama, K. Nogita, “Rapid Cu6Sn5 growth at liquid Sn/solid Cu interfaces”, Scripta Materialia, 100 (2015) 17-20.
  27. Y. Wen, B. Wang, G. Zeng, K. Nogita, D. Ye, L. Wang, “Electrochemical and structural study of layered P2-Na2/3Ni1/3Mn2/3O2 as cathode materials for sodium-ion batteries”, Chemistry – An Asian Journal, 10 (2015) 661-666.
  28. G. Zeng, S. D. McDonald, Q. F. Gu, Y. Terada, K. Uesugi, H. Yasuda and K. Nogita, “The influence of Ni and Zn additions on microstructure and phase transformations in Sn-0.7Cu/Cu solder joints”, Acta Materialia, 83 (2015) 357–371.
  29. H. Henao, A. Sugiyama and K. Nogita, “Comparison of solidification behavior between in-situ observation and simulation of Fe- C-Si system”, Journal of Alloys and Compounds, 613 (2014) 132–138.
  30. G. Zeng, S. D. McDonald, D. K. Mu, Y. Terada, H. Yasuda, Q. F. Gu and K. Nogita, “Ni segregation in the interfacial (Cu,Ni)6Sn5 intermetallic layer of Sn-0.7Cu-0.05Ni/Cu ball grid array (BGA) joints”, Intermetallics, 54 (2014) 20-27.
  31. G. Zeng, S. D. McDonald, J. J. Read, Q. F. Gu and K. Nogita, “Kinetics of the polymorphic phase transformation of Cu6Sn5”, Acta Materialia, 69 (2014) 135–148.
  32. G. Zeng, S. D. McDonald, Q. F. Gu, K. Sweatman and K. Nogita, “Effects of element addition on the β→α transformation in tin”, Philosophical Magazine Letters, 94, 2 (2014) 53-62.
  33. G. Zeng, S. D. McDonald, C.M. Gourlay, K. Uesugi, Y. Terada, H. Yasuda and K. Nogita, “Solidification of Sn-0.7Cu-0.15Zn solder: In-situ observation”, Metallurgical and Materials Transactions A, 45A (2014) 918-926.
  34. K. Nogita, H. Yasuda, A. Prasad, S. D. McDonald, T. Nagira, N. Nakatsuka, K. Uesugi and D. H. StJohn, “Real time synchrotron X-ray observations of solidification in hypoeutectic Al-Si alloy”, Materials Characterization, 85 (2013) 134-140.
  35. G. Zeng, S. D. McDonald, Q. Gu, S. Suenaga, Y. Zhang, J. Chen and K. Nogita, “Phase stability and thermal expansion behavior of Cu6Sn5 intermetallics doped with Zn, Au and In”, Intermetallics, 43 (2013) 85-98.
  36. K. Nogita, C. M. Gourlay, S. D. McDonald, S. Suenaga, J. Read, G. Zeng and Q. F. Gu, “XRD study of the kinetics of β↔α transformations in tin”, Philosophical Magazine, 93 (2013) 3627-3647.
  37. K. Nogita, S. D. McDonald, A. Duguid, M. Tsubota and Q. F. Gu, “Hydrogen desorption of Mg-Mg2Ni hypo-eutectic alloys in Air, Ar, CO2, N2 and H2”, Journal of Alloys and Compounds, DOI: 10.1016/j.jallcom.2013.01.006, accepted on 4th January 2013.
  38. D. Mu, H. Huang, S. D. McDonald, J. Read and K. Nogita, “Investigating the mechanical properties, creep and crack pattern of Cu6Sn5 and (Cu,Ni)6Sn5 on diverse crystal planes”, Materials Science and Engineering A, 566 (2013) 126-133.
  39. Y. Q. Wu, S.D. McDonald, J. Read, H. Huang and K. Nogita, “Determination of the minimum Ni concentration to prevent the η to η4+1 polymorphic transformation of stoichiometric Cu6Sn5”, Scripta Materialia, 68 (2013) 595–598.
  40. K. Nogita, H. Yasuda, S. D. McDonald and K. Uesugi, “Real time synchrotron X-ray imaging for nucleation and growth of Cu6Sn5 in Sn-7Cu-0.05Ni high temperature lead-free solder alloys”, Advanced Materials Research, 626 (2013) 200-204.
  41. D. Mu, H. Huang, S. D. McDonald and K. Nogita, “Creep and mechanical properties of Cu6Sn5 and (Cu,Ni)6Sn5 at elevated temperatures”, Journal of Electronic Materials, 42, 2 (2013) 304-311.
  42. S. D. McDonald, K. Nogita, J. Read, T. Ventura, and T. Nishimua, “Influence of composition on the morphology of primary Cu6Sn5 in Sn-4Cu Alloys”, Journal of Electronic Materials, 42, 2 (2013) 256-262.
  43. Y.Q. Wu, J.C. Barry, T. Yamamoto, Q.F. Gu, S.D. McDonald, S. Matsumura, H. Huang, and K. Nogita, “A new phase in stoichiometric Cu6Sn5”, Acta Materialia, 60 (2012) 6581–6591.
  44. D. Mu, H. Huang and K. Nogita, “Anisotropic mechanical properties of Cu6Sn5 and (Cu,Ni)6Sn5”, Materials Letters, 86 (2012) 46-49.
  45. G. Zeng, S. D. McDonald, Q. F. Gu and K. Nogita, “Effect of Zn, Au and In on the polymorphic phase transformation in Cu6Sn5 intermetallics”, Journal of Materials Research, Vol. 27, No. 20 (2012) 2609- 2614.
  46. D. Mu, H. Yasuda, H. Huang and K. Nogita, “Growth orientations and mechanical properties of Cu6Sn5 and (Cu,Ni)6Sn5 on poly-crystalline Cu”, Journal of Alloys and Compounds, 536 (2012) 38-46.
  47. K. Nogita, D. Mu, S. D. McDonald, J. Read and Y. Q. Wu, “Effect of Ni on phase stability and thermal expansion of Cu6-xNixSn5 (X=0, 0.5, 1, 1.5 and 2)”, Intermetallics, 26 (2012) 78-85.
  48. G. Zeng, S. D. McDonald and K. Nogita, “Development of high-temperature solders: review”, Microelectronics Reliability, 52 (2012) 1306-1322.
  49. H. Yasuda, K. Nogita, Y. Yamamoto, T. Nagira, M. Yoshiya, K. Uesugi, K. Umetani, A. Takeuchi, Y. Suzuki, “Investigation of solidification behaviour in aluminium alloys by synchrotron radiation X-ray”, Journal of the Japan Institute of Light Metals, Vol. 61, No. 12 (2011) 736-742.
  50. K. Nogita, C. M. Gourlay, S. D. McDonald, Y. Q. Wu, J. Read and Q. F. Gu, “Kinetics of the η - η’ transformation in Cu6Sn5”, Scripta Materialia, 65 (2011) 922-925.
  51. D. Mu, J. Read, Y-F. Yang and K. Nogita, “Thermal expansion of Cu6Sn5 and (Cu,Ni)6Sn5”, Journal of Materials Research, Vol. 26, Issue 20 (2011) 2660 - 2664.
  52. M. Yan, S. Kohara, J. Q. Wang, K. Nogita, G. B. Schaffer, and M. Qian, “Topological structure influence on the bulk glass formation in Al-based metallic glasses”, Scripta Materialia, 65 (2011) 755-758.
  53. C. M. Gourlay, A.K. Dahle, T. Nagira, N. Nakatsuka, K. Nogita, K. Uesugi, and H. Yasuda, “Granular deformation mechanisms in semi-solid alloys”, Acta Materialia, 59 (2011) 4933-4943.
  54. C. M. Gourlay, K. Nogita, A. K. Dahle, Y. Yamamoto, K. Uesugi, T. Nagira, M. Yoshiya and H.Yasuda, “In-situ investigation of unidirectional solidification in Sn-0.7Cu and Sn-0.7Cu-0.06Ni”, Acta Materialia, 59 (2011) 4043–4054.
  55. K. Nogita, “A hydrogen storage system utilising as-cast magnesium based alloys”, Ceramics Japan (Bulletin of the ceramic society of Japan), Vol. 46, No. 3 (2011) 196-200.
  56. K. Nogita, “Eutectic modification and porosity formation in Al-Si alloys”, Journal of Japan Foundry Engineering Society (ISSN 1342-0429), Vol. 83, No. 2 (2011) 167-175.
  57. H. Tsukamoto, T. Nishimura, S. Suenaga, K. Sweatman, S. D. McDonald and K. Nogita, “The influence of solder composition on the impact strength of lead-free solder ball grid array joints”, Microelectronics Reliability, 51, 3 (2011) 657-667.
  58. K. Nogita, “Why is there less cracking when Ni is added to Sn-Cu lead-free solder joints?”, Electronic Packaging Technology, Vol. 26, No. 11 (2010) 32-38.
  59. K. Nogita, H. Yasuda, C. M. Gourlay, S. Suenaga, H. Tsukamoto, S. D. McDonald, A. Takeuchi, K. Uesugi and Y. Suzuki, “Synchrotron micro-XRF measurements of trace element distributions in BGA type solders and solder joints”, Transactions of The Japan Institute of Electronics Packaging (Trans JIEP, ISSN 1883-3365, JP: 01021609), Vol. 3, No. 1 (2010) 40-46.  
  60. K. Nogita, M. C. Greaves, B. D. Guymer, B. B. Walsh, J. M. Kennedy, M. D. Duke and T. Nishimura, “The performance of lead-free solders during a long-distance electric vehicle race”, Transactions of The Japan Institute of Electronics Packaging (Trans JIEP, ISSN 1883-3365, JP: 01021609), Vol. 3, No. 1 (2010) 104-109.  
  61. H. Tsukamoto, T. Nishimura, S. Suenaga and K. Nogita, “Shear and tensile impact strength of lead-free solder ball grid arrays placed on Ni (P)/Au surface-finished substrates”, Materials Science & Engineering B, 171 (2010) 162–171.
  62. U. Schwingenschlögl, C. di Paola, K. Nogita and C. M. Gourlay, “The influence of Ni additions on the relative stability of η and η’ Cu6Sn5”, Applied Physics Letters, 96, 061908 (2010) 1-3.
  63. K. Nogita, “Stabilisation of Cu6Sn5 by Ni in Sn-0.7Cu-0.05Ni lead-free solder alloys”, Intermetallics, 18 (2010) 145-149.
  64. C.M. Gourlay, K. Nogita, J. Read and A.K. Dahle, “Intermetallic formation and fluidity in Sn-rich Sn-Cu-Ni alloys”, Journal of Electronic Materials, 39 (1) (2010) 56-69. [Editor’s Choice].
  65. K. Nogita, H. Yasuda, M. Yoshiya, S. D. McDonald, K. Uesugi, A. Takeuchi and Y. Suzuki, “The role of trace element segregation in the eutectic modification of hypoeutectic Al-Si alloys”, Journal of Alloys and Compounds, Vol. 489, Issue 2 (2010) 415-420.
  66. K. Nogita, S. D. McDonald, H. Tsukamoto, J. Read, S. Suenaga and T. Nishimura, “Inhibiting cracking of interfacial Cu6Sn5 by Ni additions to Sn-based lead-free solders”, Transactions of The Japan Institute of Electronics Packaging (Trans JIEP, ISSN 1883-3365, JP: 01021609), Vol. 2, No. 1 (2009) 46-54.  
  67. H. Tsukamoto, T. Nishimura and K. Nogita, “Epitaxial growth of Cu6Sn5 formed at Sn-based lead-free solder/ non-textured polycrystalline Cu plate interface”, Materials Letters, Vol.63, Issue 30 (2009) 2687-2690.
  68. K. Nogita, S. Ockert, J. Pierce, M. C. Greaves, C. M. Gourlay and A. K. Dahle, “Engineering the Mg-Mg2Ni eutectic transformation to produce improved hydrogen storage alloys” International Journal of Hydrogen Energy, Vol. 34, No. 18 (2009) 7686-7691.
  69. H. Yasuda, K. Nogita, C. M. Gourlay, M. Yoshiya and T. Nagira, ”In-situ observation of Sn alloy solidification at SPring-8”, Journal of the Japan Welding Society, Vol.78, No.7 October (2009) 6-9.
  70. H. Tsukamoto, Z. Dong, H. Huang T. Nishimura and K. Nogita, “Nanoindentation characterization of intermetallic compounds formed between Sn-Cu (-Ni) ball grid arrays and Cu substrates”, Materials Science & Engineering B, 164, 1 (2009) 44-50.
  71. K. Nogita, C. M. Gourlay and T. Nishimura, “Cracking and phase stability in reaction layers between Sn-Cu-Ni solders and Cu substrates”, JOM (A publication of The Minerals, Metals & Materials Society), Vol. 61, No. 6 (2009) 45-51.
  72. M. Bermingham, S. D. McDonald, K. Nogita, D. StJohn and M. Dargusch, “Effects of boron on microstructure in cast titanium alloys”, Scripta Materialia 59, 5 (2008) 538-541.
  73. K. Nogita and T. Nishimura, “Nickel stabilised hexagonal (Cu,Ni)6Sn5 in Sn-Cu-Ni lead-free solder alloys”, Scripta Materialia, 59 (2008) 191-194.
  74. K. Nogita, C. M. Gourlay, J. Read, T. Nishimura, S. Suenaga and A. K. Dahle, "Effects of phosphorus on microstructure and fluidity of Sn-0.7Cu-0.05Ni lead-free solder", Materials Transactions, 49, 3 (2008) 443-448.
  75. C.M. Gourlay, J. Read, K. Nogita and A.K. Dahle, "The maximum fluidity length of solidifying Sn-Cu-Ag-Ni solder alloys", Journal of Electronic Materials, 37, 1 (2008) 51-60.
  76. T. Ventura, C.M. Gourlay, K. Nogita, T. Nishimura, M. Rappaz, A.K. Dahle, "The influence of 0-0.1 wt.% Ni on the microstructure and fluidity length of Sn-0.7wt%Cu-xNi", Journal of Electronic Materials, 37, 1 (2008) 32-39.
  77. C. M. Gourlay, K. Nogita, S. D. McDonald, T. Nishimura, K. Sweatman and A. K. Dahle, “A rheological assessment of the effect of trace level Ni additions on the solidification of Sn-0.7Cu”, Scripta Materialia, 54, 9 (2006) 1557-1562.
  78. K. Nogita, J. Read, T. Nishimura, K. Sweatman, S. Suenaga and A. K. Dahle, “Microstructure control in Sn-0.7mass%Cu alloys”, Materials Transactions, Vol. 46, No. 11 (2005) 2419-2425.

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Patents
  1. Andrew Duguid, Kazuhiro Nogita, Xin Fu Tan, John Taylor, Mg-X alloy, Hydrexia Pty Ltd, PCT/AU2016/050660, 2016: Australia.
  2. Andrew Duguid, Kazuhiro Nogita, Xin Fu Tan, John Taylor, Mg-based alloy for hydrogen storage, Hydrexia Pty Ltd, PCT/AU2016/050659, 2016: Australia.
  3. T. Nishimura, K. Nogita, S. D. McDonald, J. Read, G. Zeng, “Low temperature brazing alloys”, Japanese Patent Application No.2013-183232, 04/09/2013.
  4. T. Nishimura, K. Nogita, S. D. McDonald, J. Read, C. M. Gourlay, “Process for producing solder joint with improved reliability”, International Patent Application No: WO/2013/002112, 21/6/2012.
  5. T. Nishimura, K. Nogita, S. D. McDonald, J. Read, T. Ventura, “Solder alloy”, International Patent Application No: WO 2012/137901-A1, 11/10/2012.
  6. T. Nishimura, S. Suenaga, K. Nogita, C. M. Gourlay, J. Read, A. K. Dahle, “Method of regulating nickel concentration in lead-free solder containing nickel, involves adding phosphorous to tin-nickel alloy, maintaining at specified temperature and removing dross which floats on the surface of liquid phase” International Patent Application No: WO 2009/104271-A1, 27/8/2009.

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Awards
  1. Best first year PhD student presentation, UQ-EAIT Postgraduate conference, S. Mehreen, “Development of Sn-Cu alloys for High Temperature Soldering Applications”, 7th June 2016.
  2. Best Poster Award, the 1st Electronic Packaging Interconnect Technology Symposium (EPITS 2015), Penang, Malaysia, 21st November (2015). K. M. Watling, A. Chandler-Temple, K. Nogita, “XPS analysis of oxide films on lead-free solders with trace additions of germanium and gallium”. 
  3. "EAIT 2013 Professional Staff Excellence Award Nominee" in the category of exceptional performance (J. Read)
  4. Translation Award, 2013 EAIT Research, Innovation and Supervision (RIS) Awards (K. Nogita).
  5. The Professor Gordon Dunlop Prize, The Best Presentation Related to Materials Engineering, G. Zeng, “In-situ observation of solidification in micro-alloyed Sn-0.7Cu solder alloys”, UQ Engineering Postgraduate Research Conference, 3rd June 2013.
  6. Excellent Research Achievement Award, K. Nogita, Nihon Superior Co. Ltd., 20th September (2012).
  7. The 2012 UQ-UniQuest Trailblazer innovative and entrepreneurial ideas competition, K. Nogita and S. D. McDonald, final list “Spontaneous growth of a battery anode”, UniQuest Pty Ltd., The University of Queensland, August (2012).
  8. UQ Postgraduate Student, The Best Paper Award, D. Mu, “Critical properties of Cu6Sn5 for high- temperature and 3D packaging applications”.
  9. ICEP2009 Outstanding Paper Award, K. Nogita, S. Suenaga, S. D. McDonald, H. Tsukamoto, J. Read and T. Nishimura,     “Inhibition of Cracking in Cu6Sn5 Intermetallic Compounds at Sn-Cu Lead-Free Solders and Cu Substrate Interfaces”.
  10. Modified Vehicle Class - Small Car (Electric) Award, “Deep Green Research” Li-ion battery car, Eco Challenge, Global Green Challenge, Darwin to Adelaide, 24-30 October (2009).

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Refereed Conference Proceedings
  1. A. Prasad, E. Liotti, S.D. McDonald, K. Nogita, H. Yasuda, P.S. Grant and D.H. StJohn, “Real-time synchrotron x-ray observation of equiaxed solidification of aluminium alloys and implications for modelling”, IOP Conf. Series: Materials Science and Engineering 84 (2015) 012014; doi:10.1088/1757-899X/84/1/012014, Proc. Modeling of Casting, Welding and Advanced Solidification Processes (MCWASP XIV 2015), Awaji Island, Hyogo, Japan, 21st June to 26th June (2015).
  2. M. A. A. Mohd Salleh, A. Sugiyama, H. Yasuda, S. D. McDonald and K. Nogita, “In-situ soldering process technique by synchrotron X-ray imaging”, Applied Mechanics and Materials, 754-755 (2015) 508-512.
  3. W. Ng, G. Zeng, T. Nishimura, K. Sweatman, S. D. McDonald, K. Nogita, “The beneficial effect of Zn additions on the microstructure of SnCu and SnCuNi solder joints to Cu substrates”, Proc. Int. Conf. Electronics Packaging 2015, Kyoto, Japan, 14th to 17th April (2015) FE3-4.
  4. K. Sweatman, S. D. McDonald, M. Whitewick, T. Nishimura, and K. Nogita, “Grain refinement for improved lead-free solder joint reliability”, SMT Surface Mount Technology Magazine, Volume 29, Issue 1, (2014) 30-41.
  5. R. Ozaki, H. Yasuda, K. Nogita, T. Nagira, M. Yoshiya and Y. Terada, “Distribution of modifier elements in hypereutectic Al-Si alloy and a suggestion of the mechanism of modification”, Proc. 9th Pacific Rim International Conference on Modeling of Casting and Solidification Processes, Osaka, Japan, 24th to 26th November (2014) 25B-12, pp.215-217.
  6. G. Zeng, S. D. McDonald, K. Sweatman, and K. Nogita, “Tin pest in lead-free solders? - Fundamental studies on the effect of impurities on phase transformation kinetics -”, Proc. Int. Conf. Electronics Packaging 2014, Toyama, Japan, 23rd to 25th April (2014) TB2-1, pp.135-139.
  7. K. Nogita, J. Kennedy, J. Amsler, M. Greaves, C. Tuesley, and T. Nishimura, “Lead-free solders for solar and electric vehicles - Reflections on The Bridgestone World Solar Challenge 2013 in “Arrow1” -”, Proc. Int. Conf. Electronics Packaging 2014, Toyama, Japan, 23rd to 25th April (2014) WA1-3, pp. 10-13.
  8. K. Nogita, D. Mu, S. D. McDonald, J. Read, and K. Sweatman, “Crack Formation and Propagation Mechanisms in Interfacial Cu6Sn5”, Proc. Int. Conf. Electronics Packaging 2013, Osaka, Japan, 10th to 12th April (2013) FC4-3.
  9. M. A. A. M. Salleh, S. D. McDonald and K. Nogita, “Non-metallic reinforced lead-free composite solder fabrication methods and its reinforcing effects to the suppression of intermetallic formation: Short review”, Applied Mechanics and Materials, 421 (2013) 260-266.
  10. M. A. A. M. Salleh, A. M. M. Al Bakri, F. Somidin, A. V. Sandu, N. Saud, H Kamaruddin, S. D. McDonald, K. Nogita, “A comparative study of solder properties of Sn-0.7Cu lead-free solder fabricated via the powder metallurgy and casting methods”, Revista de Chimie, Volume 64, Issue 7 (2013) 725-728.
  11. K. Sweatman, S. D. McDonald, M. Whitewick, T. Nishimura, and K. Nogita, “Grain refinement for improved lead-free solder joint reliability”, Proc. IPC APEX EXPO 2013, San Diego, CA, USA, 19th to 21st February (2013) S11.
  12. K. Nogita, H. Yasuda, S. D. McDonald and K. Uesugi, “Real time synchrotron X-ray imaging for nucleation and growth of Cu6Sn5 in Sn-7Cu-0.05Ni high temperature lead-free solder alloys”, Proc. ICAMTE 2012, Penang, Malaysia, 28-30 November (2012).
  13. K. Sweatman, T. Nishimura, S. D. McDonald and K. Nogita, “Effect of cooling rate on the intermetallic layer in solder joints”, SMT Surface Mount Technology Magazine, Volume 27, Issue 11, November (2012) 68-77.
  14. K. Nogita, “Industry-university collaboration and advances in lead-free solder technology”, Proc. SMTA Pan Pacific Microelectronics Symposium, Kaui, Hawaii, USA, 14th to 16th February (2012).
  15. K. Sweatman, T. Nishimura, K. Nogita, “The Stability of Cu6Sn5 in the formation and performance of lead-free solder joints”, Proc. SMTA Pan Pacific Microelectronics Symposium, Kaui, Hawaii, USA, 14th to 16th February (2012).
  16. K. Sweatman, T. Nishimura, S. D. McDonald and K. Nogita, “Effect of cooling rate on the intermetallic layer in solder joints”, Proc. IPC APEX EXPO, San Diego, CA, USA, 28 February to 1 March (2012) 862-887.
  17. K. Sweatman, J. Read, T. Nishimura and K. Nogita, “The effect of microalloy additions on the morphology and growth of interfacial intermetallic in low-Ag and no-Ag Pb-free solders”, Proc. SMTA international, Fort Worth Convention Center, Fort Worth, Texas 16th to 20th October (2011).
  18. D. Mu, J. Read, Y. F. Yang, K. Nogita, “Thermal expansion behavior of Cu6Sn5 in high temperature lead-free solder joints”, Proc. Int. Conf. Electronics Packaging 2011. Nara, Japan, April (2011). TC5-3.
  19. K. Nogita, H. Yasuda, C. M. Gourlay, S. Suenaga, H. Tsukamoto, S. D. McDonald, A. Takeuchi, K. Uesugi and Y. Suzuki, “Trace element distribution in solder joints between Sn-based solders and Cu substrates.”, Proc. Int. Conf. Electronics Packaging 2010. Sapporo, Japan, May (2010). FB1-4.
  20. K. Nogita, M. Greaves, B. Guymer, B. Walsh, J. Kennedy, M. Duke and T. Nishimura, “Lead-Free Solders for Electric Vehicles - Global Green Challenge - Eco-Challenge Racing”, Proc. Int. Conf. Electronics Packaging 2010. Sapporo, Japan, May (2010). FB2-1.
  21. D. Mu, H. Tsukamoto, H. Huang, and K. Nogita, “Formation and mechanical properties of intermetallic compounds in Sn-Cu high-temperature lead-free solder joints”, Materials Science Forum, 654-656 (2010) 2450-2454.
  22. H. Tsukamoto, Z. Dong, H. Huang, T. Nishimura and K. Nogita, “Nanoindentation characterization of intermetallics formed at the lead-free solder/Cu substrate interface”, Materials Science Forum, 654-656 (2010) 2446-2449.
  23. K. Nogita, M. Jenke, D. Wood, A. Duguid and S. D. McDonald, ”Characterisation of hydrogen release behaviour in cast Mg-Ni alloys by synchrotron XRD and XAFS”, Materials Science Forum, 654-656 (2010) 2851-2854.
  24. T. Ventura, C.M. Gourlay, K. Nogita, M. Rappaz and A. K. Dahle, “The influence of Ni additions on the solidification of Sn-0.7%Cu solder”, Proc. of the Int. Conf. and Exhibition on Materials and AustCeram 2009 (MA2009), Gold Cost, Australia, July (2009).
  25. H. Tsukamoto, T. Nishimura, S. Suenaga, S. D. McDonald, J. Read and K. Nogita, “Ball impact behavior of Sn-Cu (-Ni) lead-free solder joints”, Proc. of the Int. Conf. and Exhibition on Materials and AustCeram 2009 (MA2009), Gold Cost, Australia, July (2009).
  26. H. Tsukamoto, Z. Dong, H. Huang, T. Nishimura and K. Nogita, “Nanoindentation characterization of intermetallic compounds formed at the Sn-Cu(-Ni) solder/ Cu substrate interface”, Proc. of the Int. Conf. and Exhibition on Materials and AustCeram 2009 (MA2009), Gold Cost, Australia, July (2009).
  27. H. Tsukamoto, T. Nishimura, S. Suenaga, S. D. McDonald, J. Read and K. Nogita, “Impact strength of Sn-Cu (-Ni) lead-free solder ball grid arrays placed on Cu substrates”, Proceedings of Int. Conf. Electronics Packaging (ICEP-2009), Kyoto, Japan (2009) K14-2-3.
  28. K. Nogita, S. Suenaga, S. D. McDonald, H. Tsukamoto, J. Read and T. Nishimura, “ Inhibition of cracking in Cu6Sn5 intermetallic compounds at Sn-Cu lead-free solders and Cu substrate interfaces”, Proc. of Int. Conf. on Electronics Packaging, Kyoto Japan, April (2009) K14-2-2. [JIEP Best Paper Award]
  29. K. Sweatman, S. Suenaga, M. Miyaoka, T. Nozu, K. Nogita, and T. Nishimura, “Effect of intermetallic stabilization on the impact resistance of joints to BGA packages”, Proceedings of the Electronic Packaging Technology Conference, EPTC 2009, Singapore, 9 December to 11 December (2009) Article number 5416526, Pages 331-335.
  30. C. Shea, J. Kenny, J. Rasmussen, G. Wable, Q. Chu, S. Teng, K. Sweatman and K. Nogita, “Copper erosion - The influence of metallurgy on copper dissolution”, Printed Circuit Design and Fab, 25, 10 (2008) 35-37.
  31. T. Ventura, K. Nogita, C.M. Gourlay, T. Nishimura, M. Rappaz, A.K. Dahle, "Solidification Characteristics of Lead-free Solder Sn-0.7Cu-0.06Ni", Proceedings of Solidification Processing 2007, University of Sheffield, UK (2007) p. 651-655.

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Conference Presentations 
  1. K. Nogita, “In-situ observations of soldering process by synchrotron imaging”, The 16th Electronic Packaging Research Symposium, Tokyo, 29th November 2016.
  2. K. Nogita, “Intermetallic Formation in Pb-Free Solders”, Electronic Packaging and Interconnect Materials, TMS Webinar lecture, TMS, 1st September (2016).
  3. S. Belyakov, M. A. A. Mohd Salleh, T. Nishimura, K. Sweatman, K. Nogita, C. M. Gourlay, “Microstructure and properties of BGA joints soldered with Sn-Cu-Ni-Bi”, Abstract of 2016 TMS Annual Meeting & Exhibition, Nashville, TN, US, 14-18 February (2016) pp. 154.
  4. M. A. A. Mohd Salleh, J. Read, Z. I. Abdullah, S. D. McDonald, K. Nogita, “Effects of trace addition of phosphorus in Sn-Cu-Ni solders”, Abstract of 2016 TMS Annual Meeting & Exhibition, Nashville, TN, US, 14-18 February (2016) pp. 154.
  5. S. Smith, Y. Wu, M. A. A. Mohd Salleh, C. M. Gourlay, S. Belyakov, S. D. McDonald, K. Nogita, “Effect of Bi on mechanical properties and CTE of Pb-free solders”, Abstract of 2016 TMS Annual Meeting & Exhibition, Nashville, TN, US, 14-18 February (2016) pp. 154.
  6. M. A. A. Mohd Salleh, S. D. McDonald, H. Yasuda, K. Nogita, “Development of a Microwave Sintered TiO2 Reinforced Sn-0.7wt%Cu-0.05wt%Ni Solder Alloy”, Abstract of 2016 TMS Annual Meeting & Exhibition, Nashville, TN, US, 14-18 February (2016) pp. 154.
  7. M. A. A. Mohd Salleh, C. M. Gourlay, H. Yasuda, A. Sugiyama, T. Nagira, S. D. McDonald, K. Nogita, “Influence of surface finish on the formation of intermetallic compounds during reflow soldering: In-situ real-time observations”, Abstract of 2016 TMS Annual Meeting & Exhibition, Nashville, TN, US, 14-18 February (2016) pp. 10.
  8. S. Belyakov, M.A.A. Mohd Salleh, T. Nishimura, K. Sweatman, K. Nogita, C. M. Gourlay, “Effects of Bi on microstructure formation and properties of Sn-Cu-Bi based solders”, Abstract of 2016 TMS Annual Meeting & Exhibition, Nashville, TN, US, 14-18 February (2016) pp. 73.
  9. K. Nogita, C. M. Gourlay, M.A.A. Mohd Salleh, G. Zeng, Y. Wu, S. D. McDonald, “New concept solders/interconnects for 3D packaging”, Abstract of 2016 TMS Annual Meeting & Exhibition, Nashville, TN, US, 14-18 February (2016) pp. 94.
  10. T. Nishimura, M.A.A. Mohd Salleh, G. Zeng, K. Sweatman, S. D. McDonald and K. Nogita, “Enhanced stabilization of η Cu6Sn5 in Pb-free solder joints”, Abstract of 2016 TMS Annual Meeting & Exhibition, Nashville, TN, US, 14-18 February (2016) pp. 132.
  11. K. Nogita, X. Q. Tran, S. D. McDonald, S. Matsumura, “Hydrogen release mechanisms in bulk MgH2 by ultra-high voltage transmission electron microscopies”, 24th Australian Conference on Microscopy and Microanalysis (ACMM24), Melbourne, Australia, 31st January to 4th of February 2016.
  12. M.A.A. Mohd Salleh, J.W Xian, C. M. Gourlay, H. Yasuda, S. D. McDonald and K. Nogita, “In-situ synchrotron real-time imaging of soldering: Experiment methods and post experiment analysis”, 24th Australian Conference on Microscopy and Microanalysis (ACMM24), Melbourne, Australia, 31st January to 4th of February 2016.
  13. K. Nogita, M. Nave, S. Smith, J. Read, Y. Wu, S. D. McDonald, “EBSD measurements of anisotropic residual stress and strain distributions in tin-based solder alloys”, 24th Australian Conference on Microscopy and Microanalysis (ACMM24), Melbourne, Australia, 31st January to 4th of February 2016.
  14. K. Nogita, “Case study of University-Industry R&D between Australia and Japan”, Invited Talk, Japan-Australia University Symposium 2015, University of Sydney, 24th November 2015.
  15. S. Smith, J. Read, S. D. McDonald and K. Nogita, “Peritectic reactions and phase transformations of Sn-30wt%Cu for high temperature Pb-free soldering applications”, Abstract of the 1st Electronic Packaging Interconnect Technology Symposium (EPITS 2015), Penang, Malaysia, 21st November (2015).
  16. K. M. Watling, A. Chandler-Temple, K. Nogita, “XPS analysis of oxide films on lead-free solders with trace additions of germanium and gallium”, Abstract of the 1st Electronic Packaging Interconnect Technology Symposium (EPITS 2015), Penang, Malaysia, 21st November (2015). [Best Poster Award].
  17. K. Nogita, B. Kefford, J. Read and S. D. McDonald, “Suppression of Cu3Sn with Ni in high Cu containing Sn-Cu solder alloys”, Abstract of the 1st Electronic Packaging Interconnect Technology Symposium (EPITS 2015), Penang, Malaysia, 21st November (2015).
  18. K. Nogita, M. A. A. M. Salleh, X. Q. Tran, J. Read, S. Smith and S. D. McDonald, “Effects of trace phosphorus in Sn-Cu-Ni wave solder dross”, Abstract of the 1st Electronic Packaging Interconnect Technology Symposium (EPITS 2015), Penang, Malaysia, 21st November (2015).
  19. M. A. A. Mohd Salleh, R. M. Said, N. Saud, H. Yasuda, S. D. McDonald and K. Nogita, “Effect of TiO2 on the formation of primary and interfacial Cu6Sn5 in Sn-0.7wt%Cu and Sn-0.7wt%Cu-0.05wt%Ni solder paste during soldering”, Abstract of the 1st Electronic Packaging Interconnect Technology Symposium (EPITS 2015), Penang, Malaysia, 21st November (2015).
  20. C. M. Gourlay, Z. L. Ma, J. W. Xian,  S. A. Belyakov, M. A. A. Mohd Salleh, G. Zeng, H. Yasuda and K. Nogita, “Solidification of Sn-3Ag-0.5Cu and Sn-0.7Cu-0.05Ni solders”, Abstract of the 1st Electronic Packaging Interconnect Technology Symposium (EPITS 2015), Penang, Malaysia, 21st November (2015).
  21. M. A. A. Mohd Salleh, “In-situ soldering process imaging of Sn-Cu lead-free solder systems on Cu substrate: Initial intermetallic compound formation and its subsequent growth”, EAIT Postgraduate Conference 2015, pp27.
  22. K. Nogita, “Case study of University R&D between Australia and Japan”, Invited Speaker, Workshop, Japan-Australia Science and Innovation Collaboration, Australian Embassy, Tokyo, Japan, 12th May (2015).
  23. W. Ng, G. Zeng, T. Nishimura, K. Sweatman, S. D. McDonald, K. Nogita, “The beneficial effect of Zn additions on the microstructure of SnCu and SnCuNi solder joints to Cu substrates”, Abstract of Int. Conf. Electronics Packaging 2015, Kyoto, Japan, 14th to 17th April (2015) FE3-4.
  24. T. Nishimura, K. Sweatman, S. Sawada, D. Mu, G. Zeng and K. Nogita, “The performance of solid solution strengthened no silver lead free solder in elevated temperature service”, Abstract of 2015 TMS Annual Meeting & Exhibition, Orlando, FL, US, 15-19 March (2015) pp. 249.
  25. J. Xian, G. Zeng, S. Belyakov, B. Britton, K. Nogita, C. Gourlay, “Anisotropie thermal expansion of Ni3Sn4, Cu6Sn5 and Beta-Sn: A powder XRD study”, Abstract of 2015 TMS Annual Meeting & Exhibition, Orlando, FL, US, 15-19 March (2015) pp. 275.
  26. G. Zeng, S. D. McDonald, J. Read, T. Nishimura, K. Sweatman, K. Nogita, “Phase formation, transformation and stability in micro-alloyed Sn-based lead-free solder alloys and joints”, Abstract of 2015 TMS Annual Meeting & Exhibition, Orlando, FL, US, 15-19 March (2015) pp. 276.
  27. K. Nogita, G. Zeng, S. D. McDonald, J. Read, S. Smith, T. Nishimura, “Cu-Al intermetallics for grain refinement of primary Cu6Sn5 in Sn-xCu (x=0.7 to 7.6wt%) solders”, Abstract of 2015 TMS Annual Meeting & Exhibition, Orlando, FL, US, 15-19 March (2015) pp.275.
  28. M. A. A. Mohd Salleh, A. Sugiyama, H. Yasuda, S. D. McDonald and K. Nogita, “In-situ imaging of Sn-Cu lead-free soldering on Cu substrates: Intermetallic compound formation and growth”, Abstract of 2015 TMS Annual Meeting & Exhibition, Orlando, FL, US, 15-19 March (2015) pp. 179.
  29. M. A. A. Mohd Salleh, A. Sugiyama, H. Yasuda, S. D. McDonald and K. Nogita, “In-situ soldering process technique by synchrotron X-ray imaging”, Proc. of 3rd Int. Conf. on Advanced Material Engineering and Technology (ICAMET 2014), Ho Chi Minh City, Vietnam, 5-6 December (2014).
  30. K. Nogita, “Advanced characterisation techniques for material development”, Keynote Speech, Proc. of 3rd Int. Conf. on Advanced Material Engineering and Technology (ICAMET 2014), Ho Chi Minh City, Vietnam, 4-6 December (2014).
  31. Y. Q. Wu, J. C. Barry, T. Yamamoto, H. Huang, S. Matsumura and K. Nogita, “A new phase in stoichiometric Cu6Sn5”, The 8th International Conference on Advanced Materials Processing (ICAMP2014), Gold Coast, 28-30 July (2014) pp. 69.
  32. Y. Q. Wu, H. Huang, S. D. McDonald and K. Nogita, “Development of ZnAl based alloy for use on Al conductors”, The 11th Asia-Pacific Conference on Materials Processing (APCMP2014), Auckland, New Zealand, 6 to 11 July (2014).
  33. G. Zeng, S. D. McDonald, Q. F. Gu, S. Suenaga and K. Nogita, “Kinetics of the polymorphic phase transformation of Cu6Sn5”, Abstract of 2014 TMS Annual Meeting & Exhibition, San Diego, CA, US, 16-20 February (2014).
  34. G. Zeng, S. D. McDonald, Q. F. Gu, H. Yasuda, Y. Terada and K. Nogita, “Influence of Ni/Zn on the Interfacial Reactions between Sn-0.7Cu Solder and Cu Substrates”, Abstract of 2014 TMS Annual Meeting & Exhibition, San Diego, CA, US, 16-20 February (2014).
  35. K. Nogita, S. D. McDonald, G. Zeng, J. Read and T. Nishimura, “Suppression of Cu3Sn in high Cu content Pb-free solders”, Invited Talk, Abstract of 2014 TMS Annual Meeting & Exhibition, San Diego, CA, US, 16-20 February (2014).
  36. K. Nogita, “Characteristic of SN100C – effects of trace elements -”, Nihon Superior Internepcon Technical Meeting, Tokyo, Japan 16th January (2014).
  37. K. Nogita, “Developments in high reliability lead-free solders by NS CMEM”, Invited Lecture, 43rd Internepcon Japan Technical Conference, Tokyo Big Sight, Tokyo, Japan, 15th to 17th January (2014) INJ-1.
  38. K. Nogita, “Advances in lead-free solder alloys for micro-electronic applications”, Keynote Speech, Proc. of 2nd Int. Conf. on Advanced Material Engineering and Technology (ICAMET 2013), Bandung, Indonesia, 28-29 Nov. (2013).
  39. K. Nogita, J. C. Barry, Y. Q. Wu, T. Yamamoto, G. Zeng, Q. F. Gu,  S. Matsumura, “Crystallography of monoclinic Cu6Sn5”, Abstract for The 14th Frontiers of Electron Microscopy in Materials Science (FEMMS), Lorne, VIC, 8th to 13th September (2013) Poster.
  40. M. A. A. M. Salleh, S. D. McDonald and K. Nogita, “Non-metallic reinforced lead-free composite solder fabrication methods and its reinforcing effects to the suppression of intermetallic formation: Short review”, 4th International Conference on Information Technology for Manufacturing Systems (ITMS 2013), 28-29 August, Auckland, New Zealand (2013).
  41. K. Nogita, D. Mu, S. D. McDonald, J. Read, and K. Sweatman, “Crack Formation and Propagation Mechanisms in Interfacial Cu6Sn5”, Oral Presentation Int. Conf. Electronics Packaging 2013, Osaka, Japan, 10th to 12th April (2013) FC4-3.
  42. K. Nogita, “A collaborative approach to the development of electronic materials”, Keynote Speech, Proc. International Conference on Sustainable Materials Engineering (ICoSM2013), Batu Ferighi, Penang Island, Malaysia, 26th to 27th March (2013).
  43. K. Nogita, “Case studies of R&D: University and industry relationships”, Invited Talk, Universiti Malaysia Perlis (UniMAP), School of Engineering Seminar, Hotel Seri Malaysia Kangar, Malaysia, 24th March (2013).
  44. K. Nogita, “Case study of University R&D between Queensland and Japan”, Invited Talk, Japan External Trade Office (JETRO) and Queensland Government Seminar, Sydney, 14th March (2013).
  45. K. Nogita, C. M. Gourlay, S. D. McDonald, S. Suenaga, J. Read, G. Zeng and Q. F. Gu, “Characteristics of beta/alpha transformations in high purity tin”, Invited Talk, Abstract of 2013 TMS Annual Meeting & Exhibition, San Antonio, Texas, US, 3-7 March (2013).
  46. Y.Q. Wu, J. C. Barry, T, Yamamoto, Q.F. Gu, H. Huang, S. Matsumura and K. Nogita, “New phase in stoichiometric Cu6Sn5 and effect of Ni addition on phase stabilization in wide temperature range”, Abstract of 2013 TMS Annual Meeting & Exhibition, San Antonio, Texas, US, 3-7 March (2013).
  47. G. Zeng, S. D. McDonald, J. Read, C.M. Gourlay, H. Yasuda and K. Nogita, “In-situ observation of solidification in micro-alloyed Sn-0.7Cu solder alloys”, Abstract of 2013 TMS Annual Meeting & Exhibition, San Antonio, Texas, US, 3-7 March (2013).
  48. G. Zeng, S. D. McDonald, Q. F. Gu and K. Nogita, “Effect of Zn, Au and In on the phase stability and thermal expansion of Cu6Sn5 intermetallics”, Abstract of 2013 TMS Annual Meeting & Exhibition, San Antonio, Texas, US, 3-7 March (2013).
  49. K. Sweatman, M. Miyaoka, T. Nishimura, X. Q. Tran, S. D. McDonald, K. Nogita, “Modified hypereutectic Sn-Cu Pb-free solder for high temperature applications”, Abstract of 2013 TMS Annual Meeting & Exhibition, San Antonio, Texas, US, 3-7 March (2013).
  50. C. M. Gourlay, S. Belyakov, G. Zeng, H. Yasuda, K. Nogita, “Solidification of Sn-0.7Cu-0.05Ni solder”, Abstract of 2013 TMS Annual Meeting & Exhibition, San Antonio, Texas, US, 3-7 March (2013).
  51. K. Nogita, “Scientific development of lead-free solder alloys”, Keynote Speech, Proc. of Int. Conf. on Advanced Material Engineering and Technology (ICAMET 2012), Batu Ferighi, Penang Island, Malaysia, 28-30 Nov. (2012).
  52. K. Nogita, H. Yasuda, S. D. McDonald and K. Uesugi, “Real time synchrotron X-ray imaging for nucleation and growth of Cu6Sn5 in Sn-7Cu-0.05Ni high temperature lead-free solder alloys”, Proc. of Int. Conf. on Advanced Material Engineering and Technology (ICAMET 2012), Batu Ferighi, Penang Island, Malaysia, 28-30 Nov. (2012).
  53. Y.Q. Wu, Q.F. Gu, S.D. McDonald, J. Read, H. Huang and K. Nogita, “Characterisation of Sn-Cu based lead-free solders using synchrotron radiation”, Abstract for Australian Synchrotron User Meeting, Melbourne, Australia, 29th to 30th  November, (2012).
  54. G. Zeng, S. D. McDonald, J. Read, Q. F. Gu, H. Yasuda and K. Nogita, “New phase in stoichiometric Cu6Sn5 and effect of Ni addition on phase stabilization studied by Synchrotron XRD”, Abstract for Australian Synchrotron User Meeting, Melbourne, Australia, 29th to 30th  November, (2012).
  55. G. Zeng, “Development of high performance lead-free solder”, UQ Postgraduate Student Conference, The University of Queensland, 4th June (2012).
  56. D. Mu, “Critical properties of Cu6Sn5 for high- temperature and 3D packaging applications”, UQ Postgraduate Student Conference, The University of Queensland, 4th, June (2012).
  57. K. Nogita; S. D. McDonald; D. Mu; C. M. Gourlay; K. Sweatman; T. Nishimura, “Transformation kinetics and dimensional stability of Cu6Sn5”, Proc. of TMS Annual Meeting, Orlando, FL, USA, 11th to 15th Mar, (2012).
  58. K. Nogita, S. D. McDonald, J. Read, S. Suenaga, “Time – temperature - transformation diagrams of high purity powdered tin”, Proc. of TMS Annual Meeting, Orlando, FL, USA, 11th to 15th Mar, (2012).
  59. K. Nogita, S. D. McDonald; J. Read; T. Ventura; M. Miyaoka; K. Sweatman; T. Nishimura, “Influence of composition on the morphology of primary Cu6Sn5 in Sn-4Cu Alloys”, Proc. of TMS Annual Meeting, Orlando, FL, USA, 11th to 15th Mar, (2012).
  60. D. Mu, H. Huang, K. Nogita, “Effect of temperature on the mechanical properties of Cu6Sn5 and (Cu,Ni)6Sn5”, Proc. of TMS Annual Meeting, Orlando, FL, USA, 11th to 15th Mar, (2012).
  61. K. Sweatman, J. Read, T. Nishimura, K. Nogita, “The effect of composition on the thickness morphology and growth of interfacial intermetallic in Pb-Free solders”, Proc. of TMS Annual Meeting, Orlando, FL, USA, 11th to 15th Mar, (2012).
  62. K. Nogita, D. Mu, J. Read and S. D. McDonald, “Kinetics and thermal expansion of Cu6Sn5”, Proc. of Japan Institute of Metals Fall Meeting, Okinawa, Japan, 7th to 9th November, (2011). 
  63. K. Nogita, “Materials for sustainable energy solutions”, The University of Queensland Global Challenges Leadership Series, Hotel Okura, Tokyo, Japan, 5th October (2011).
  64. K. Nogita, “Lead-free soldering technology”, The Advanced Materials Processing and Manufacturing Centre (AMPAM) Workshop, Brisbane Technology Park, Eight Mile Plains, Brisbane, 11th May (2011).
  65. D. Mu, J. Read, Y. F. Yang, K. Nogita, “Thermal expansion behavior of Cu6Sn5 in high temperature lead-free solder joints”, Proc. Int. Conf. Electronics Packaging 2011. Nara, Japan, April (2011). TC5-3.
  66. K. Sweatman, K. Nogita, H. Tsukamoto and T. Nishimura, “The stability window and mechanical properties of the interfacial intermetallic in lead-free solder joints:”, Proc. of TMS Annual Meeting, San Diego, USA, 27th February to 3rd March, (2011) p. 450.
  67. K. Nogita, J. Read, H. Tsukamoto and S. D. McDonald, “Effect of Ni on the phase stability of Cu6Sn5 for Sn-Cu lead-free solders”, Abstract for Australian Synchrotron User Meeting, Melbourne, Australia, 22nd to 24th November, (2010).
  68. K. Nogita, J. C. Barry, J. Read, S. D. McDonald, C. M. Gourlay and T. Nishimura, “Effect of Ni concentration on the phase stability of Cu6Sn5”, Proc. of Japan Institute of Metals Fall Meeting, Sapporo, Japan, 25th to 27th September, (2010) pp. 484.
  69. K. Nogita, H. Yasuda, S. Suenaga, H. Tsukamoto, C. M. Gourlay and Y. Suzuki, “Trace element distribution in Sn-based solders”, Proc. of Japan Institute of Metals Fall Meeting, Sapporo, Japan, 25th to 27th September, (2010) pp. 236.
  70. D. Mu, H. Tsukamoto, H. Huang, and K. Nogita, “Formation and mechanical properties of intermetallic compounds in Sn-Cu high-temperature lead-free solder joints”, Proc. of PRICM7 (The 7th Pacific Rim International Conference on Advanced Materials and Processing), Cairns, Australia, 1st to 6th August 2010 Cairns, (2010).
  71. H. Tsukamoto, Z. Dong, H. Huang, T. Nishimura and K. Nogita, “Nanoindentation characterization of intermetallics formed at the lead-free solder/Cu substrate interface”, Proc. of PRICM7 (The 7th Pacific Rim International Conference on Advanced Materials and Processing), Cairns, Australia, 1st to 6th August 2010 Cairns, (2010).
  72. K. Nogita, “Discovery of the stabilisation of an allotropic transformation in Cu6Sn5 intermetallics”, Proc. of the 21st Australian Conference on Electron Microscopy, Brisbane, Australia, 11th-15th July, (2010) p. 215.
  73. H. Yasuda, K. Nogita, C. M. Gourlay, M. Yoshiya, T. Nagira, S. D. McDonald, K. Uesugi, A. Takeuchi and Y. Suzuki, “Synchrotron time-resolved X-ray imaging and micro-X-ray fluorescence mapping of nonfaceted/faceted eutectic alloy solidification”, Proc. of the 21st Australian Conference on Electron Microscopy, Brisbane, Australia, 11th-15th July, (2010) p. 154.
  74. K. Nogita, H. Yasuda, C. M. Gourlay, S. Suenaga, H. Tsukamoto, S. D. McDonald, A. Takeuchi, K. Uesugi and Y. Suzuki, “Trace element distribution in solder joints between Sn-based solders and Cu substrates.”, Proc. Int. Conf. Electronics Packaging 2010. Sapporo, Japan, 12-14th May (2010).
  75. K. Nogita, M. Greaves, B. Guymer, B. Walsh, J. Kennedy, M. Duke and T. Nishimura, “Lead-Free Solders for Electric Vehicles - Global Green Challenge - Eco-Challenge Racing”, Proc. Int. Conf. Electronics Packaging 2010. Sapporo, Japan, 12-14th May (2010).
  76. K. Nogita, J. Read, H. Tsukamoto, S. D. McDonald, C. M. Gourlay and T. Nishimura, “The effect of Ni on phase stability in Cu6Sn5”, Proc. of Japan Institute of Metals Fall Meeting, Kyoto, Japan, 14th to 16th September, (2009).
  77. K. Nogita, “Inhibition of cracking in lead-free solder joints”, Poster presentation of Industry Event, the University of Queensland, Faculty of Engineering, Architecture and Information Technology, Brisbane, 1st September (2009).
  78. T. Ventura, C.M. Gourlay, K. Nogita, M. Rappaz and A. K. Dahle, “The influence of Ni additions on the solidification of Sn-0.7%Cu solder”, Proc. of The Int. Conf. and Exhibition on Materials and AustCeram 2009 (MA2009), Gold Cost, Australia, 1st to 3rd July (2009).
  79. H. Tsukamoto, T. Nishimura, S. Suenaga, S. D. McDonald, J. Read and K. Nogita, “Ball impact behavior of Sn-Cu (-Ni) lead-free solder joints”, Proc. of The Int. Conf. and Exhibition on Materials and AustCeram 2009 (MA2009), Gold Cost, Australia, 1st to 3rd July (2009).
  80. H. Tsukamoto, Z. Dong, H. Huang, T. Nishimura and K. Nogita, “Nanoindentation characterization of intermetallic compounds formed at the Sn-Cu(-Ni) solder/ Cu substrate interface”, Proc. of The Int. Conf. and Exhibition on Materials and AustCeram 2009 (MA2009), Gold Cost, Australia, 1st to 3rd July (2009).
  81. K. Nogita, C. M. Gourlay, T. Nishimura, S. Suenaga, S. D. McDonald and H. Tsukamoto, “The influence of Ni content on cracking in IMC reaction layers between Sn-Cu-Ni solders and Cu substrates”, Proc. of TMS Annual Meeting, San Francisco, USA, 8th Feb to 12th Feb, (2009).
  82. H. Tsukamoto, K. Nogita, S. D. McDonald, T. Nishimura, S. Suenaga, and K. W. Seatman, “The Influence of solder composition on the impact strength of lead-free solder BGA joints”, Proc. of TMS Annual Meeting, San Francisco, USA, 8th Feb to 12th Feb, (2009).
  83. K. Nogita, T. Nishimura, S. Suenaga, K. W. Sweatman, S. D. McDonald, H. Tsukamoto, “Role of Ni in stabilistation of  intermetallic compounds in Sn-Cu Alloys”, Proc. of Japan Institute of Metals Fall Meeting, Kumamoto, Japan, 22nd-25th September, (2008).
  84. K. Nogita, H. Yasuda, Y. Yamamoto, C. M. Gourlay, K. Uesugi, “Real-time observations of Cu6Sn5 precipitation in lead-free solders”, Proc. of Japan Institute of Metals Fall Meeting, Kumamoto, Japan, 22nd-25th September, (2008).
  85. T. Ventura, C. M. Gourlay, K. Nogita, M. Rappaz, A. K. Dahle, “Solidification mechanisms in the Sn-Cu-Ni lead-free solder system”, Proceedings of Second International Conference on Advances in Solidification Processes, June 17-20, (2008) University of Leoben, Austria.
  86. K. Watling, K. Nogita and A. K. Dahle, “Surface tension and oxide film studies of lead-free solders”, Proc. of TMS Annual Meeting, New Orleans, USA, 9th Mar to 13rd Mar, (2008) p. 39.
  87. Y. Yamamoto, K. Nogita, C. M. Gourlay, A. K. Dahle, K. Uesugi and H. Yasuda “In-situ observation of unidirectional solidification in Sn-0.7Cu and Sn-0.7Cu-0.06Ni by X-ray imaging”, Proc. of TMS Annual Meeting, New Orleans, USA, 9th Mar to 13rd Mar, (2008) p. 285.
  88. K. Nogita, J. Read, C. M. Gourlay, T. Nishimura, S. Suenaga and A. K. Dahle, “Effects of phosphorus on fluidity and microstructure of Sn-xCu-yNi lead-free solder”, Proc. of TMS Annual Meeting, New Orleans, USA, 9th Mar to 13rd Mar, (2008) p. 285.
  89. K. Nogita, J. Read, C. M. Gourlay, T. Nishimura, S. Suenaga and A. K. Dahle, “Effects of phosphorus on fluidity and microstructure of Sn-0.7Cu-0.05Ni lead-free solder”, Proc. of Japan Institute of Metals Fall Meeting, Gifu, Japan, 19th-21st September, (2007) p.216.
  90. K. Nogita, J. Read, C. M. Gourlay, T. Nishimura, S. Suenaga and A. K. Dahle, “Effects of Ag and Ni additions on fluidity of Sn-0.7mass%Cu alloys”, Proc. of Japan Institute of Metals Annual Meeting, Chiba, Japan, 27th-29th March, (2007) p.301.
  91. K. Nogita, T. Ventura, C. M. Gourlay, T. Nishimura and A. K. Dahle, “Solidification characterstics of eutectic Sn-0.7mass%Cu solder with trace Ni”, Proc. of Japan Institute of Metals Annual Meeting, Chiba, Japan, 27th-29th March, (2007) p.301.
  92. T. Ventura, C.M. Gourlay, K. Nogita, T. Nishimura, M. Rappaz, A.K. Dahle, “The solidification of Pb-free Solder Sn-0.7%Cu containing trace Ni additions”, Proc. of TMS Annual Meeting, Orlando, USA, 25th Feb to 1st Mar, (2007) p. 265.
  93. K. Nogita, C. M. Gourlay, J. Read and A. K. Dahle, “Solidification characteristics, microstructure and fluidity of Pb-free solders”, Proc. of TMS Annual Meeting, Orlando, USA, 25th Feb to 1st Mar, (2007) p. 264.
  94. K. Nogita, C. M. Gourlay, T. Ventura, J. D. Gates, T. Nishimura and A. K. Dahle, “Fluidity of lead-free solder Sn-0.7mass%Cu containing trace Ni additions”, Proc. of Japan Institute of Metals Fall Meeting, Niigata, Japan, 16th-18th September, (2006) p.441.
  95. K. Nogita, J. Read, T. Nishimura, K. Sweatman, S. Suenaga and A. K. Dahle, "Microstructure control in Sn-0.7mass%Cu alloys", Proc. of Japan Institute of Metals Fall Meeting, Hiroshima, Japan, 28th-30th September, (2005) p.295.

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Synchrotron beam times

Australian Synchrotron 

  1. K. Nogita, “In-situ Characterisation of new cathode materials for high performance Na-ion batteries”, Australian Synchrotron, 06/10/2016 - 07/10/2016, Reference No: AS163/PD/11311.
  2. K. Nogita, “Investigating the kinetics of polymorphic phase transformation in Mg2NiH4 and the crystal structure of its low-temperature twinned polymorph”, Australian Synchrotron, 04/10/2016 - 06/10/2016, Reference No: AS163/PD/11309.
  3. D. Qu, K. Nogita, “Mapping of trace element on the cross section of ZnAlSi coating onto steel substrate”, Australian Synchrotron, 27/09/2016 – 29/09/2016, Reference No: AS163/XFM/11281.
  4. K. Nogita, “BlueScope Steel – XFM – Using X-ray Fluorescence Microscopy to Aid Development of Improved, Value-Added Flat-Steel Products”, Australian Synchrotron, 08/06/2016 – 09/06/2016, Reference No: AS162/XFM/11000.
  5. K. Nogita, “BlueScope Steel – XFM – Using X-ray Fluorescence Microscopy to Aid Development of Improved, Value-Added Flat-Steel Products”, Australian Synchrotron, 03/05/2016 – 04/05/2016, Reference No: AS161/XFM/10634.
  6. K. Nogita and Q. Gu, “Anisotropy of co-efficient of thermal expansion in Cu6Sn5 with trace element additions”, Australian Synchrotron, 05/05/2016 – 08/05/2016, Reference No: AS161/PD/10430.
  7. K. Nogita, X. Tran and Q. Gu, “Na-doped Mg2Ni for hydrogen storage/separation purposes”, Australian Synchrotron, 06/11/2015 – 09/11/2015, Reference No: AS153/PD/9884.
  8. K. Nogita, X. Tran, J. Read, and Q. Gu, “Investigating the effect of gas impurities on the hydrogen absorption of Na-doped Mg2Ni for hydrogen storage/separation puroses”, Australian Synchrotron, 24/07/2015 – 27/07/2015, Reference No: AS152/PD/9378.
  9. K. Nogita, “In-situ study on the influence of Cu crystal orientation on solder reaction kinetics”, Australian Synchrotron International Access Program, 20/04/2015 - 23/04/2015, Reference No: AS/IA151/9538.
  10. K. Nogita, “Real-time observation of intermetallic formation between liquid solder and Cu substrates”, Australian Synchrotron International Access Program, 28/01/2015 - 31/01/2015, Reference No: AS/IA143/9218.
  11. K. Nogita, G. Zeng, J. Read, and Q. Gu, “Compositional dependence of crystal structure and phase transformation kinetics of interfacial Cu6Sn5 in lead-free solder joints”, Australian Synchrotron, 30/07/2014 – 01/08/2014, Reference No: AS142/PD/7943.
  12. K. Nogita, G. Zeng, J. Read and Q. Gu, “Characterisation of Li-ion battery anode reactions for improved performance”, Australian Synchrotron, 01/04/2014 – 03/04/2014, Reference No: AS141/PD/7413.
  13. K. Nogita, G. Zeng, X. Tran and Q. Gu, “Effects of trace elements on hydrogen absorption kinetics in Mg alloys”, Australian Synchrotron, 24/10/2013 – 26/10/2013, Reference No: AS133/PD/7099.
  14. K. Nogita, D. Mu, Q. Gu, G. Zeng and J. Read, “In-situ XRD analysis of Li-ion battery anode reactions”, Australian Synchrotron, 30/07/2013-02/08/2013, Reference No: AS132/PD/6371 and AS132/PDFI/6371, Funding: $1015.
  15. Y. Q. Wu, J. C. Barry, K. Nogita, “Determination of new monoclinic phase in stoichiometric Cu6Sn5 by single crystal X-ray microdiffraction”, 01/08/2013-02/08/2013, Australian Synchrotron, Reference No.: AS132/MXII/6416, Funding: $1015
  16. K. Nogita, G. Zeng, M. A. Salleh, A. Sugiyama, J. Read and Q. Gu, “Phase transformation kinetics of Cu6Sn5 formed on Cu substrates”, Australian Synchrotron, 01/05/2013-05/05/2013, Reference No: AS131/PD/5784, Funding: $1265
  17. K. Nogita, “Trace elements distributions in Sn-Cu and Sn-Zn lead-free solder joints (SPring-8 2012B1440@BL37XU)”, Australian Synchrotron International Access Program, 19/12/2012 - 22/12/2012, Reference No: AS/IA124/6235, Funding: $8600.
  18. K. Nogita, “Real-time nucleation and growth observations of alpha-Al in Al-Si alloys (SPring-8 BL20B2 2012B1430)”, Australian Synchrotron International Access Program, 03/10/2012-05/10/2012, Reference No: AS/IA123/5664, Funding: $6600.
  19. K. Nogita, G. Zeng and J. Read, “The effect of impurity elements on the kinetics of Tin-pest”, Australian Synchrotron, 10/10/2012-13/10/2012, Reference No: AS123/PD/5327, Funding: $1265
  20. K. Nogita, Y. Q. Wu and J. Read, “Determination of new monoclinic phase in stoichiometric Cu6Sn5 by single crystal X-ray microdiffraction”, Australian Synchrotron, 09/10/2012-09/10/2012, Reference No: AS123/MX/5342, Funding: $1265
  21. K. Nogita, G. Zeng and J. Read, “Phase stability of Cu6Sn5 with Zn, Au, In and Sb at low temperatures”, Australian Synchrotron, 01/06/2012-03/06/2012, Reference No: AS122/PD/4903, Funding: $1265  
  22. K. Nogita, G. Zeng and J. Read, “Phase transformation of Cu6Sn5 intermetallics doping Zn, Au, In”, Australian Synchrotron, 24/02/2012-26/02/2012, Reference No: AS121/PD/4524, Funding: $1265
  23. K. Nogita, D. Mu, G. Zeng and J. Read, “In-situ XRD analysis of phase transformations in Cu6Sn5 on Cu substrates”, Australian Synchrotron, 26/10/2011-27/10/2011, Reference No: AS113/PDFI/4113, Funding: $1265
  24. K. Nogita, D. Mu and J. Read, “Tin-pest formation in lead-free solder alloys at low temperatures”, Australian Synchrotron, 08/07/2011-10/07/2011, Reference No: AS112/PD/3712, Funding: $1265
  25. K. Nogita, Y. Q. Wu and J. Read, “Effect of Ni on the phase stability of Cu6Sn5 under low temperature”, Australian Synchrotron, 28/04/2011-03/05/2011, Reference No: P3364, Funding: $1265
  26. K. Nogita, Y. Q. Wu, J. Read, “New monoclinic phase of Cu6Sn5 intermetallics”, Australian Synchrotron, 11/11/2010-13/11/2010, Reference No: FI2907, Funding: $1265
  27. H. Tsukamoto, J. Read and K. Nogita, “(GI)SAXS/WAXS study on epitaxial growth, residual stresses and topology of cracks in the Cu6Sn5 layer formed between lead-free solders and Cu substrates”, Australian Synchrotron, 15/10/2010 – 16/10/2010, Reference No: P2934, Funding: $1265
  28. K. Nogita, Q. Gu and J. Read, “Kinetics of phase transformation of Cu6Sn5 intermetallics”, Australian Synchrotron, 08/05/2010 - 10/05/2010, Reference No: AS101/PD2249, Funding: $1265
  29. K. Nogita and J. Read, “Elucidation of stabilisation of solid state phase transformation on the Cu6Sn5 by simultaneous measurement of micro-XRF and micro-XRD”, Australian Synchrotron, 19/05/2009 - 23/05/2009, Reference No: AS_IA091_Spring82009A1159, Funding: $6200
  30. K. Nogita, D. Mu and J. Read, “The detection of phase transformations and/or stabilisation of Cu6Sn5 intermetallics with and without Ni”, Australian Synchrotron, 28/02/2009 - 02/03/2009, Reference No: AS091/PD/FI_QLD, Funding: $1250

Spring-8 Synchrotron radiation facility, Japan

  1. K. Nogita, A. Sellah, C. Gourlay, H. Yasuda, A. Sugiyama, T. Nagira, and K. Uesugi, “In-situ study of the transient liquid phase bonding process in metastable Sn-Cu alloys”, SPring-8, BL20B2, No. 2016B1319. 06/12/2016 – 08/12/2016.
  2. K. Nogita, H. Yasuda, A. Sugiyama, T. Nagira, A. Sellah and K. Uesugi, “In-situ study on the influence of Cu crystal orientation on solder reaction kinetics”, SPring-8, BL20XU, No. 2015A1675. 20/04/2015 – 23/04/2015.
  3. K. Nogita, H. Yasuda, A. Sugiyama, T. Nagira, A. Sellah and K. Uesugi, “Real-time observation of intermetallic formations between liquid solder and Cu substrates”, SPring-8, BL20XU, No. 2014B1620. 28/01/2015 – 31/01/2015.
  4. K. Nogita, G. Zeng, H. Yasuda, Y. Terada, “Determination of Zn and Ni distribution in Sn-Cu-X solder joints subject to thermal aging”, SPring-8, BL37XU, No. 2013B1524.
  5. K. Nogita, H. Yasuda, Y. Suzuki, A. Takeuchi and K. Uesugi, “Trace elements distributions in Sn-Cu and Sn-Zn lead-free solder joints”, SPring-8, BL37Xu, No. 2012B1440.
  6. K. Nogita, H. Yasuda, A. Prasad, Y. Suzuki, A. Takeuchi and K. Uesugi, “Real-time nucleation and growth observations of α-Al in Al-Si alloys”, SPring-8, BL20B2, No. 2012B1430.
  7. K. Nogita, H. Yasuda, Y. Suzuki, A. Takeuchi and K. Uesugi, “Real-time nucleation and growth observations of primary Cu6Sn5 in novel Sn-4Cu-X alloys”, SPring-8, BL20B2, No. 2012A1192.
  8. K. Nogita, H. Yasuda, Y. Suzuki, A. Takeuchi and K. Uesugi, “Real-time solidification and phase transformation observations for Sn-Cu high temperature Pb-free solders”, SPring-8, BL20XU, No. 2011B1048, 2012.
  9. K. Nogita, D. Mu, ”Effects of eutectic modifier elements on liquid clusters for non-faceted/faceted eutectic alloys”, SPring-8, BL04B2, No. 2010B1195, 2011.
  10. K. Nogita, H. Yasuda, S. Suenaga, Y. Suzuki, A. Takeuchi and K. Uesugi, “Elucidation of stabilisation of solid state phase transformation on the Cu6Sn5 by simultaneous measurement of micro-XRF and micro-XRD”, SPring-8, BL47XU, No. 2009A1159, 2009.

Kyushu Synchrotron, SAGA-LS, Japan

  1. K. Nogita and M. Miyaoka, “Small area pole figure measurements of intermetallics formed at lead-free solder joint”, Kyushu Synchrotron SAGA-LS, BL15 XRD, No.     081151N, 2009.
  2. K. Nogita, “Identifications of Cu, Ni atoms and crystallography of (Cu,Ni)6Sn5 in lead-free solder Sn-0.7Cu-xNi”, Kyushu Synchrotron SAGA-LS, BL15 XRD and XAFS, No. 080625N, 2008.

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